JPS59232448A - 液冷容器 - Google Patents

液冷容器

Info

Publication number
JPS59232448A
JPS59232448A JP10670183A JP10670183A JPS59232448A JP S59232448 A JPS59232448 A JP S59232448A JP 10670183 A JP10670183 A JP 10670183A JP 10670183 A JP10670183 A JP 10670183A JP S59232448 A JPS59232448 A JP S59232448A
Authority
JP
Japan
Prior art keywords
cooling
liquid
container
cooled
fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10670183A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0126543B2 (en]
Inventor
Kishio Yokouchi
貴志男 横内
Koichi Niwa
丹羽　紘一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP10670183A priority Critical patent/JPS59232448A/ja
Publication of JPS59232448A publication Critical patent/JPS59232448A/ja
Publication of JPH0126543B2 publication Critical patent/JPH0126543B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP10670183A 1983-06-16 1983-06-16 液冷容器 Granted JPS59232448A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10670183A JPS59232448A (ja) 1983-06-16 1983-06-16 液冷容器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10670183A JPS59232448A (ja) 1983-06-16 1983-06-16 液冷容器

Publications (2)

Publication Number Publication Date
JPS59232448A true JPS59232448A (ja) 1984-12-27
JPH0126543B2 JPH0126543B2 (en]) 1989-05-24

Family

ID=14440306

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10670183A Granted JPS59232448A (ja) 1983-06-16 1983-06-16 液冷容器

Country Status (1)

Country Link
JP (1) JPS59232448A (en])

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6354758A (ja) * 1986-05-30 1988-03-09 デイジタル　イクイプメント　コ−ポレ−シヨン 一体形ヒ−トパイプモジュ−ル
US5655598A (en) * 1995-09-19 1997-08-12 Garriss; John Ellsworth Apparatus and method for natural heat transfer between mediums having different temperatures
US6019167A (en) * 1997-12-19 2000-02-01 Nortel Networks Corporation Liquid immersion cooling apparatus for electronic systems operating in thermally uncontrolled environments
US6227287B1 (en) * 1998-05-25 2001-05-08 Denso Corporation Cooling apparatus by boiling and cooling refrigerant
US6820684B1 (en) * 2003-06-26 2004-11-23 International Business Machines Corporation Cooling system and cooled electronics assembly employing partially liquid filled thermal spreader

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57103338A (en) * 1980-12-19 1982-06-26 Hitachi Ltd Boiling cooling device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57103338A (en) * 1980-12-19 1982-06-26 Hitachi Ltd Boiling cooling device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6354758A (ja) * 1986-05-30 1988-03-09 デイジタル　イクイプメント　コ−ポレ−シヨン 一体形ヒ−トパイプモジュ−ル
US5655598A (en) * 1995-09-19 1997-08-12 Garriss; John Ellsworth Apparatus and method for natural heat transfer between mediums having different temperatures
US6019167A (en) * 1997-12-19 2000-02-01 Nortel Networks Corporation Liquid immersion cooling apparatus for electronic systems operating in thermally uncontrolled environments
US6227287B1 (en) * 1998-05-25 2001-05-08 Denso Corporation Cooling apparatus by boiling and cooling refrigerant
US6820684B1 (en) * 2003-06-26 2004-11-23 International Business Machines Corporation Cooling system and cooled electronics assembly employing partially liquid filled thermal spreader

Also Published As

Publication number Publication date
JPH0126543B2 (en]) 1989-05-24

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